Process equipment of the latest generation - of outstanding uniformity results.

Etching
Product family with modular and flexible designed equipment for etching silicon wafer.

Properties and benefits:

• Standard etching processes (HF /HNO3, KOH, NaOH, H3PO4, BOE, DHF , SPM, SOM etc.)
• Precise transfer times
• Homogeneous etching over entire 300 mm wafer

• Fully automatic process control