Electrochemical deposition in manual system

Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

The plating tool operates manually and can be installed in R & D environments as well as in small production lines.

Features and benefits:

• > 15 years experience in plating tools
• Modular design
• Very small footprint
• Single side processing with isolated contacts