Uniform metal deposition on surfaces and in holes. Decades of experience with Cu, Ni, Au, Sn, Ga and In plating results in our stable, low maintenance plater technology.

Features and Benefits

• Insoluble Anode and reverse pulse technology
• Up to 100 % throwing power - achieved by variable pulse amplitude and time
• Tsunami forced flow system with HDF technology
• Maintenance friendly concept

Current Transfer

• Current feed by simple contact rings with up to 1 year lifetime
• Unique de-plating concept - with cathodes outside process zone
• Small contact area < 12.7  mm (1/2 inch)