Plate Through Hole Systems to generate interconnects. The Tsunami based flow system guarantees excellent chemistry exchange in deep structures without foam generation, thus increasing the bath life time.

Features and Benefits

• Stable and reproducible process
• Proven High Density Interconnect applications
• Electroless Copper with strong copper to copper bonds
• Direct metallisation with deposition of various materials
• Tsunami forced flow system with HDF technology
• Designed for treatment of holes and vias; less on surface
• Smooth liquid flow to avoid foam and increase bath life time
• Conditioner with ultrasonic unit