Etching processes on glass and flexible substrates for TCO and absorber etching

PVGlassEtch - Glas Substrate
PVFlexxEtch - Flexible Substrate
State-of-the-art equipment and process technology offers high etching rates and homogeneous results.

Features and Benefits

• High uniform etching process technology
• Standard and customer-specific substrate sizes up to 3.3 m in width
• Inline system / Roll-to-roll technology
• Integrated automatic process control systems
• Process support by experienced process engineers from RENA
• Transport system with lateral guides
• Customised module integration solutions
• Customised safety solutions