The RENA InWaClean removes slurry and sawing residues from separated wafers in a physical-chemical process.

Features and Benefits

• The wafer is kept wet throughout the entire process until drying, in order to prevent the electrostatic bonding of particles
• Ultrasonic cleaning employing various frequencies
• No etching of wafer surface, thus best initial conditions for a variety of texture processes
• Special roller construction reduces operating costs
• Rinsing cascade reduces water consumption
• RENA AirChannelDryer technology