Wafer Cluster
Due to technology partnerships and longtime experience RENA was able to optimise the handling and process sequence for the complete process chain after sawing.
Features and Benefits
- Simple handling tool
- Effective pre-cleaning with special showerhead
- Gentle separation under water
- Automated loading of inline cleaning systems
- High throughput wafer characterisation and classification
- Higher production yield by reduced breakage rate
Reduced operator costs
