Back contect solar cell metallisation: a high volume production platform using a patented plating method deposits various metals as Ni, Cu, Sn, or Ag on different seed layers. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

Features and Benefits

• Soft contacting and low breakage by single wafer transport
• No demetallisation and transport of contact frames
• Fast and homogeneous Cu deposition
• Strong process performance proven in semiconductor technology
• Modular production system - customised for your application