Acidic cleaning processes for the removal of metallic surface contaminants, oxide and organic residues from the wafer surface.

Features and Benefits

• Various cleaning processes can be realised in the same tank system
• Patented HF/O₃ process module for cleaning and drying silicon wafers in a single process step, including ozone supply and monitoring
• Cleaning and integrated residuefree drying in a single process step
• Environmentally friendly due to reduced consumption of water and energy
• Footprint reduction due to high process integration