Removal of the mechanical saw damage after the wafer is cut.

Features and Benefits

• For fully and partially automated applications
• Tank in tank design reduces space requirements and improves process homogeneity
• Extension of the bath life due to bleed and feed function
• Low breakage rates due to advanced handling and transport systems
• Specially developed bath tank - carrier interface to prevent floating of wafers
• Wafer size conversion just on the touch screen
• Reproducible and stable processes
• Integrated etch-rate determination available on request