Fast texturing for high throughput
Texturing tuning by RENA – We minimize the process time to achieve your optimum pyramid size distribution. You specify the wafer surface, we guarantee the reproducible texturing.

Features and Benefits

• Process guarantee for a wide range of specified wafers
• SDE and texturing in one step possible
• Uniform texturing is facilitated by a pre-clean step
• Measurement of the actual silicon removal
• Short process times, typical 15 min in combination with RENA monoTEX®
• Low consumption of chemicals
• Up to 30 runs per bath make up
• Control of pyramid size to some extend, typical from 2 – 6 µm or to 6 – 10 µm
• Powerful data base for event tracking
• Flexible recipe adaption

• NEW BatchTex HT > 4800 wafers/h
• IPA free mono texturing with more than 4800 wafers/h