The InPolish system smoothens one side of the wafer using a polishing etch in an inline single side process. Thus it provides the smooth surface required for high- efficiency concepts like rear-side passivated cells, improves the back side reflection and allows for an efficient passivation of the rear surface. Together with the InSiOx and InOxSide tools, it completes RENA’s toolbox for rear-side passivated cells.

Features and Benefits

• Enables processing schemes for rear-side passivated cells
• Inline single side process:
  - Optimised footprint
  - Ideal process and work flow integration
• Suitable for both multi- and monocrystalline cells
• Technological leadership
  - Process start up by RENA
  - Etch depth and polishing grade tunable to the cell requirements