RENA Technologies GmbH
Höhenweg 1
D-78148 Gütenbach
Tel. +49 7723 9313-0
E-Mail info@rena.com

RENA

EPA - Electro Plating Automatic

Electrochemical deposition in an automatic system

Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at high plating rates.

RENA offers customised solutions for special applications.

Features and benefits:

  • > 15 years experience in plating tools
  • Modular design for maximum flexibility
  • Edge exclusion < 3mm
  • Convertible for 4", 6", 8", 12" or for special wafer geometries as rectangular substrates

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Contact person

Bernard Winker
Bernard Winker
Customised Equipment
Phone
+49 7723 9313-438
E-Mail
bernard.winker@rena.com
@ RENA
RENA Technologies GmbH | Höhenweg 1 | D-78148 Gütenbach | Tel. +49 7723 9313-0 | info@rena.com