RENA Technologies GmbH
Höhenweg 1
D-78148 Gütenbach
Tel. +49 7723 9313-0
E-Mail info@rena.com

RENA

EPM - Electro Plating Manual

Electrochemical deposition in manual system

Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

The plating tool operates manually and can be installed in R & D environments as well as in small production lines.

Features and benefits:

  • > 15 years experience in plating tools
  • Modular design
  • Very small footprint
  • Single side processing with isolated contacts

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Contact person

Mario Schwab
Mario Schwab
Customised Equipment
Phone
+49 7723 9313-438
E-Mail
mario.schwab@rena.com
@ RENA
RENA Technologies GmbH | Höhenweg 1 | D-78148 Gütenbach | Tel. +49 7723 9313-0 | info@rena.com