Engaging Innovations & Inspiring Connections at ECTC 2025

Thank you to everyone who joined us at booth 334 during ECTC 2025 in Dallas! It was a pleasure to showcase our advanced Through Glass Via (TGV) processing solutions and engage with such a forward-thinking audience.

At RENA Technologies, we specialize in wet processing. Whether for glass core substrates, semiconductors, or compound materials – our field-proven, fully automated tools have stood out for their flexibility and custom configuration capabilities.

We presented our latest Through Glass Via (TGV) glass substrate processing equipment – purpose-built for high-precision, fully automated, and flexibly configurable wet processing. Trusted by leading manufacturers, our systems demonstrated unmatched performance and adaptability across a wide range of materials.

A highlight was our alkaline-based TGV etching process, offering:
• Ultra-low taper angles < 1°
• Short process times
• Support for large substrates up to 600 × 600 mm

Thanks to everyone who visited our booth and met with our glass processing experts in Dallas. It was a great opportunity to discuss how our tools can help drive your next innovation!

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» Are you interested in our wet chemical systems? Please contact our sales team.