High throughput solution for texturing of multi crystalline Si with low CoO

The RENA InTex® automated processing equipment is for the cost effective texturing of multi crystalline silicon (mc-Si). The acidic wet chemical process allows the texturing of both slurry and diamond wire cut mc-Si wafers. It is based upon the RENA NIAK inline platform.

Features and Benefits

  • Fully automated wet chemical inline type processing system for mc-Si
  • Uses acidic (HF/HNO3) texturing process for mc-Si
  • Compatible with diamond wire cut mc-Si by use of RENA dwTEX texturing additive
  • Integrated rinsing and drying of wafer
  • Throughput up to 5000 wafer/hour
  • Compatible with M0, M1, M2 and M4 wafer size
  • Accurate dosing system for constant bath composition
  • Long bath lifetime due to feed-and-bleed function
  • Lowest breakage rate in industry
  • Based on RENA NIAK inline processing platform
  • High uptime
  • Easy maintenance


  • MES interface (SECS/GEM)
  • Media cabinet for chemical supply
  • Waste pump station for chemical drain / waste water
  • Sensors for process control (e.g. pH, conductivity)
  • Single Side Texture (SST) upgrade

Product Video


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VP Sales
Dr.-Ing. Ulrich Jäger
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