The wet processing company

InWaClean

Ultrasonic based Final Wafer Cleaning

The RENA InWaClean automated processing equipment is designed for the final cleaning step in the wafer manufacturing process. Cleaning is done by ultrasonic and a detergent and is supported by DI water rinses. It is based upon the RENA NIAK inline platform.

Features and Benefits

  • Fully automated wet chemical wafer cleaning system in an inline type process on 5 lanes
  • Cleaning done by detergent, ultrasonic treatment and DI water rinsing
  • Integrated rinsing and drying of wafer
  • Throughput up to 5000 wafer/hour
  • Compatible with M0, M1, M2 and M4 wafer size
  • Long bath lifetime due to feed-and-bleed function
  • Uses O-ring free roller design
  • Low breakage rate
  • Based on RENA NIAK inline processing platform
  • High uptime
  • Easy maintenance

Options

  • MES interface (SECS/GEM)
  • Sensors for process control (e.g. pH, conductivity)