The RENA EPM system unites precision and flexibility in manual electroplating. Thanks to its modular design, the system can be integrated into customer-specific process structures quickly and easily. The system supports pure metal and alloy plating with all conventional materials (Au, Ag, Cu, Sn, Ni, SnAg) and various coating chemicals. Its outstanding flow of fluid and tight control of the electric field guarantee even plating at consistently high rates. RENA’s EPM system meets the stringent requirements of semiconductor and microsystem technology.
Precision and flexibility
Creating functional metal coatings for microelectromechanical systems (MEMS), micro-forming and moulding ultra-small parts for microsystems, producing optoelectronic components, and bumping – semiconductor and microsystem technology boasts an array of applications that benefit from the precise settings of the RENA EPM system’s process parameters.
The RENA EPM system was designed to be integrated easily into research and institute environments with a focus on very small-scale production. The low floor space, modular design, and option to add on extra process modules for pre-treating, etching, and drying guarantee the flexibility customers expect when it comes to electroplating. The size and geometry of the wafers is determined solely by the wishes and requirements of the user.