High Throughput Semiconductor Processing Platform

The automatic wet processing systems for 200 mm and 300 mm wafers support processing with and without carriers. They are engineered for precise process
monitoring, high productivity and flexibility during production. The RENA Semi Processing Platform offers maximum production quality and throughput with the
flexibility to be adjusted to customer requirements. The platform highlight is a flexible carrierless handling system, which allows parallel processing of different
wafer thicknesses.

Features and Benefits

  • Precision-perfect process monitoring for tight process control
  • Flexible adjustment to specific production specifications
  • Full compliance with the SEMI standard
  • Processing with and without carriers
  • High throughput rates up to 500 wafers/h (depending on process sequence)
  • Flexible loading/unlaoding solution (SMIF, FOUP, Open Cassette, interface to OHT/Stockers/AGV)
Sales Director Semiconductor
Oliver Pohl
ResponsibleResponsible for the following countries: