zurück zur Übersicht

30. 07. 2020

Cutting-edge inline wafer processing up to M12

With our new InOxSide 3 we launched an improved tool for wet chemical surface treatment of wafers from M0 to M12. Higher throughput and reduced CoO are just some of the benefits of the third tool generation. Also check our video of the InOxSide 3.

InOxSide 3 - Details

Nehmen Sie Kontakt auf!
Telefon : +49 7723 9313-0