RENA Technologies GmbH offers an extensive product portfolio in wet processing of semiconductor wafers. We manufacture manual, semi-automated and fully-automated equipment as well as custom designed chemical stations with outstanding process control. We also provide patented technologies for wet processes such as metal etching and metal lift-off. RENA’s versatile wet processing platforms and technologies can be utilized both in front-end-of-line (FEOL) and back-end-of-line (BEOL) applications to fabricate integrated circuits (IC), MEMS sensors, photonic, RF and power devices.
Our semiconductor surface treatment tools are capable of processing all types of semiconductors and compounds such as Silicon (Si), Silicon Carbide (SiC), Gallium Nitride (GaN), Gallium Arsenide (GaAs) and Indium Phosphide (InP) with wafer sizes up to 300 mm. RENA provides also electroplating platforms which enable customers to plate numerous types of pure metals like gold (Au), silver (Ag), cupper (Cu) and nickle (Ni) as well as alloys.