Semiconductor wafer fabrication requires highly stable systems and consistent processing of the wafer surface. Wafers can be made of monocrystalline silicon, silicon carbide, gallium arsenide, indium phosphide or glass. RENA has various systems for producing wafers from the different materials.
The Acid Etching System (AES) achieves excellent wafer production. This fully automated system meets all requirements for high-end wafer production for wafers up to 300 mm and complies with SEMI standards. Fitted with a quick converter transport system that allows wafers to be changed in the etching bath in under one second, RENA wafering systems really stand out from the crowd in this regard and achieve perfect etch homogeneity. In addition, the half-pitch system ensures the highest throughput rates.
The Polish Cleaning System (PCS) is your best choice in silicon wafer cleaning and ensures a perfect wafer surface. The wet-to-dry cleaning system after polishing specifically removes impurities and foreign particles. The system is suitable for wafers with a diameter of up to 300 mm. On top of that, it does not matter whether it is a full- or half-pitch setup, carrier-less or with carrier processing.
For the final step of fully automated final cleaning, RENA offers the Final Cleaning System (FCS). With the Marangoni dryer, you achieve the perfect final treatment of your semiconductor wafers. Best quality at high throughput!
High flexibility and process control during wafering
The automatic wet processing systems for 200 mm and 300 mm wafers support processing with and without carriers. Precision-perfect process monitoring also allows all the operational and process parameters to be tracked and recorded accurately during production, while the platforms can be flexibly adapted to customer-specific process sequences.
This way, normal- or half-pitch undergo (acid) etching, post-polish cleaning, and final cleaning all in a single production sequence within an optimum production cycle.
