The RENA BatchGlass N50 is an advanced solution engineered for processing glass wafers in alkaline media, with a focus on high-precision via formation. Specifically developed for the fabrication of blind vias and through-glass vias (TGVs), this system meets the growing demand for intricate microstructuring in glass substrates.
Ideal for RF applications, the Batch N50 enables high-quality vias production across a variety of substrate thicknesses. 
Designed for pilot-scale production, the BatchGlass N50 is a semi-automated system that combines manual wafer input with fully automated internal batch handling. The tool supports wafer sizes up to 300 mm, making it a flexible choice for R&D and small-volume manufacturing environments.