Manual & automatic Electro-Plating systems

RENA electroplating systems

RENA’s manual and automatic electroplating systems are underpinned by the company’s many years of experience and extensive expertise as a leader in technology. These systems give wafer manufacturers maximum flexibility coupled with outstanding precision. Tight control of the electrical field and an optimum flow of fluid guarantee a high level of consistency in plating, producing outstanding results. RENA’s electroplating systems are ideal for producing semiconductor and microsystem technology in individual series, small-scale, and mass production.

EPM 2

RENA EPM 2 - the next generation of manual electroplating.

Suitable for a wide range of applications due to modular design and low floor space.

EPA

RENA EPA systems help automate the electroplating process. With automated wafer handling in single- and stacked-layer processes, precise control of the electrical field, and an outstanding flow of fluid, RENA EPA systems achieve a high level of consistency in plating. High and scalable plating rates and a modular design are just two of the systems’ additional benefits.

Features and areas of application

RENA’s flexible electroplating systems are used for plating using pure metals (Au, Ag, Cu, Sn, Ni) and alloys (SnAg). Its flexible systems support processing of square and circular substrates and those with special wafer geometries. The modular platforms are geared entirely toward the user’s requirements and can be configured for this specific application in line with the customer’s individual needs.

RENA electroplating systems are suited to a wide range of applications. The platforms are primarily used in semiconductor and microsystem technology, where they deliver outstanding results in the production of MEMS, optoelectronics as well as in micro-forming, moulding, and bumping for microsystems.