RENA’s manual and automatic systems for electroplating are underpinned by the company’s many years of experience and extensive expertise as a leader in technology. Our systems give wafer manufacturers maximum flexibility coupled with outstanding precision. Tight control of the electrical field and an optimum flow of fluid guarantee a high level of consistency in plating, producing outstanding results. Electroplating systems by RENA are ideal for producing semiconductor and microsystem technology in individual series, small-scale, and mass production.
RENA’s flexible systems for electroplating are used for plating using pure metals (Au, Ag, Cu, Sn, Ni) and alloys (SnAg). Its flexible systems support processing of square and circular substrates and those with special wafer geometries. The modular electroplating platforms are geared entirely towards the user’s requirements and can be configured for this specific application in line with the customer’s individual needs like multi chamber electroplating.
RENA’s systems for electroplating are suited to a wide range of applications. The platforms are primarily used in semiconductor and microsystem technology, where they deliver outstanding results in the production of MEMS, optoelectronics as well as in micro-forming, moulding, and bumping for microsystems.
Our strength is to turn your visions into reality. To achieve this goal, we give our best every day. As a result, you can see the quality and spirit in our products: We find cost-efficient solutions for your production. Looking back at over 20 years of expertise in surface treatment, RENA offers advanced processing solutions for metal plating. With us, you can not only purchase machines with standard designs, but also customize machines specifically for your requirements. If you have any questions about us or our products, please do not hesitate to contact us. We will be happy to advise you!