RENA BatchW - wafer processing platform - high throughput, precise process control

The RENA BatchW wafer processing platform, suitable for 6" to 8" and 12" wafers, combines advanced automation with excellent process control. A key feature of the highly flexible system is that it supports both carrierless and low-mass carrier processes for wafer sizes up to 12" (300 mm). Its modular design allows full customization to meet specific requirements. To offer maximum production quality control, the semiconductor wafer processing platform tracks all parameters during production. The RENA BatchW is engineered for high uptime, easy maintenance and highest throughput. Its flexible design features special tank options, parallel processing for multiple wafer thicknesses, and multiple dryer options.

  • Etching
  • Solvent
  • Cleaning
  • Rinsing
  • Drying

Features and Benefits

  • Wafer sizes from 6" to 8" and 12" (150 to 200 and 300 mm)
  • High uptime and high throughput
  • Perfect process monitoring
  • Excellent maintainability
  • Compliant to SECS/GEM 300
  • Low water and chemical consumption and superior fluid control
  • Integrated Filter Fan Units (FFU)
  • Wide variety of special tank designs
  • Processing with and without carriers
  • Multiple dryer options
  • Flexible loading/ unloading solutions
  • Full compliance with the SEMI standard
  • Flexible adjustments to specific production specifications

 

 

Theo-Moissidis-Head-of-Sales
VP Sales
Theo Moissidis
ResponsibleResponsible for the following countries:
Worldwide