RENA’s wet etching tool for caustic or acidic applications is built to achieve outstanding surface results in semiconductor wafer production. Acidic etching combined with a fast transport system enables precise process control. For wafers up to 300 mm, this fully automated tool fulfills all requirements for high-end wafer production. On top, the carrier-less half-pitch processing capabilities guarantee highest throughput rates together with high yield. Our wafer etching platform is completely compliant to all SEMI-standards.