What does “single wafer processing” mean?
Single wafer processing refers to the processing of individual wafers in semiconductor production or chip manufacturing.
What types of wafer processing are available?
There are generally two types of wafer processes in the production of semiconductor components: Single wafer and batch wafer processing. In batch processing, as the name suggests, several wafers are processed at once. In single wafer surface processing, individual wafers (e.g. silicon carbide/SiC wafers, glass wafers) are processed.
What is the advantage of single wafer processing?
Due to the individual high-precision processing of the individual wafers in semiconductor production or in a horizontal position, the advantage lies in the high-precision processing and high uniformity.
Which method is more economical?
The operating costs and yield of microchip production are important factors to consider. Operating expenses include material expenses as part of the equation as well as utilization, throughput and yield.
Generally, throughput for wafer surface processing (wafer etching, wafer cleaning) is higher in batch systems than in single wafer systems. However, there are certain situations in which a single wafer system may be more suitable. For example, if the system works with smaller batches and can save time by using a single wafer system.
Which single wafer processing can be produced at RENA Technologies?
The wafers to be processed at RENA Technologies can be processed with the highest precision either in single wafer wet benches or in batch systems.
Our wafer handling systems enable wafer processing such as wafer etching, wafer cleaning, wafer drying in all common substrate formats: 100mm, 125mm, 150mm, 200mm and 300mm as well as all substrate materials and substrate thicknesses.
