Your Process. Our Expertise. – Demo Capabilities for Challenging Substrates

Looking for Semiconductor Demo Capabilities for Silicon, Compound Semiconductors, or Glass Wafers/Panels?

At RENA, we offer robust demo and foundry support for process validation and optimization — tailored to your substrate and application needs.

Whether you're working with silicon, compound semiconductors, or glass wafers/panels, our dedicated demo labs are equipped to help you validate and refine your wet processing steps with precision and flexibility.

Our Core Capabilities Include:

• Standard cleans, etches, and resist strips
• Damage-free batch metal lift-off (MLO) – ideal even for fragile wafers like GaAs and InP
• TGV (Through Glass Via) etching for advanced glass panel applications
• Wet strain relief etching for SiC substrates
• Porous layer formation on Si, SiC, and III-V semiconductors
• Specialized post-CMP cleaning for critical surface quality

Demo Lab Equipment & Process Scope:

• Fully equipped for up to 200 mm wafer processing
• Support for batch immersion, spray, and single wafer applications
• In-house cleanliness, critical dimension (CD), and optical metrology capabilities

Ready to validate or fine-tune your next semiconductor process?
Contact us to explore how our demo services can accelerate your development with confidence.

» Click here to get to our wet chemical solutions

» Are you interested in our wet chemical systems? Please contact our sales team.