The RENA EPM 2 system was designed to be integrated easily into research and institute environments as well as production facilities with a focus on very small-scale production. The low floor space, modular design, and option to add on extra process modules for pre-treating, etching, and drying guarantee the flexibility customers expect when it comes to electroplating.

RENA is a strong partner for electrochemical deposition applications for the device manufacturing for optoelectronic, microelectronic devices and Photonic Chips in the semiconductor business. Wafer sizes from 2 to 8 inch are feasible in our tools, further substrate sizes and geometries are possible. Depending on the application requirements different plating technologies such as vertical rack, fountain, cup and fully customized plating can be applied.