VaporDry – IPA dryer for semiconductor applications

RENA VaporDryer integrates IPA drying process with cleaning and rinsing to provide a single-step process. It is an ideal solution for displacing water from high aspect ratio features and through silicon vias (TSVs) as well as for effective drying of complex surfaces. VaporDry can be integrated into RENA batch immersion platforms. This dryer can be applied for both FEoL and BEoL applications. The entire process is monitored and controlled by RENA’s advanced IDX Flexware process control software.

Features and Benefits

  • Lower cost compared to Marangoni dryers
  • 85% reduction in IPA consumption vs. boiling sump vapor dryers
  • Robust, reliable and field proven performance
  • Outstanding particle performance (< 20 at 0.12 µm)
  • All electropolished stainless steel construction
  • Ideal for drying multiple wafer sizes
  • Completely dry “ high aspect ratio” structures and TSVs > 750 µm deep
  • Small footprint
VP Sales
Theo Moissidis
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