Acid Etching System (AES) for semiconductor wafer production

RENA’s AES wet etching tool is built to achieve outstanding surface results in semiconductor wafer production. Acidic etching combined with a fast transport system enables precise process control. For wafers up to 300 mm, this fully automated tool fulfills all requirements for high-end wafer production. On top, the carrier-less half-pitch processing capabilities guarantee highest throughput rates together with high yield. Our wafer etching platform is completely compliant to all SEMI-standards.

Features and benefits

  • Up to 300 mm wafer size
  • Outstanding shape control
  • Etch stop in under 1 second
  • Perfect etch homogeneity
  • Carrierless handling
  • Half-pitch system for highest throughput
  • Advanced process monitoring
  • Multi-wafer transport to OHT loadport
Sales Director Wafering
Theodoros Moissidis
ResponsibleResponsible for the following countries: