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Acid Etching System (AES) for semiconductor wafer production

RENA’s AES wet etching tool is built to achieve outstanding surface results in semiconductor wafer production. Acidic etching combined with a fast transport system enables precise process control. For wafers up to 300 mm, this fully automated tool fulfills all requirements for high-end wafer production. On top, the carrier-less half-pitch processing capabilities guarantee highest throughput rates together with high yield. Our wafer etching platform is completely compliant to all SEMI-standards.

Features and benefits

  • Up to 300 mm wafer size
  • Outstanding shape control
  • Etch stop in under 1 second
  • Perfect etch homogeneity
  • Carrierless handling
  • Half-pitch system for highest throughput
  • Advanced process monitoring
  • Multi-wafer transport to OHT loadport
white etching tool for high-end wafer production Up to 300 mm wafer size
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wafers in etchig bath for wafer production up to 300 mm
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blue 300 mm wafers in etch bath
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Multi-wafer transport to OHT loadport with 300 mm wafers
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Sales Director Wafering
Theodoros Moissidis
+49 7723 9313-640
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Worldwide