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Final Cleaning System (FCS)

Clean wafers are the basis for excellent semiconductor products. The fully automated RENA Final Cleaning System provides highest quality surfaces for the last wafering step. Sophisticated processes and advanced scheduling make it the perfect solution for semiconductor wafer production with high throughput and challenging requirements.

Features and benefits

  • Superior surface cleanliness for wafers up to 300 mm
  • Fully automated handling carrierless or with LMC carrier
  • Perfect finishing with RENA Marangoni Dryer
  • Standard SEMI interfaces for easy fab integration
white fully automated RENA Final Clean System for highest quality surfaces from wafers
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300 mm wafers in wet chemical cleaning bath for superior surface cleanliness
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fully automated LMC carrier handling for wafers up to 300 mm
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300 mm wafers in cleaning bath for highest quality surfaces
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LMC carrier handling over RENA Marangoni Dryer for perfect finishing of the last wafering step
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300 mm wafers in process bath, standard SEMI interfaces for easy fab integration
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Theo Moissidis Head of Sales
VP Sales
Theo Moissidis
+49 7723 9313-640
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