Thank You for Visiting RENA Technologies at CSPT 2026

A heartfelt thank you to everyone who visited RENA Technologies GmbH at CSPT 2026 in Wuxi, China.

As an exhibitor at one of the leading events for advanced packaging and substrate technologies in the semiconductor industry, we were delighted to connect with customers, partners, and industry experts from around the world.

Innovations in Through Glass Via (TGV) Technology

A key focus of our exhibition was Through Glass Via (TGV) technology, which is increasingly establishing itself as a critical enabler for glass core substrates.

As demands for higher interconnect densities, improved thermal performance, and greater dimensional stability continue to grow, glass-based packaging solutions are gaining momentum and offering significant advantages over conventional substrate technologies.

At our booth, visitors learned how RENA Technologies’ innovative wet processing solutions enable:

• Precise manufacturing and profile control of Through Glass Vias (TGVs)

• Highly uniform glass etching processes

• Scalable production of glass core substrates

• Enhanced performance for advanced packaging and chiplet architectures

Shaping the Future of Advanced Packaging

With decades of expertise in wet chemical surface treatment and process technologies, RENA Technologies supports semiconductor manufacturers worldwide with innovative equipment solutions designed to meet the challenges of next-generation packaging technologies.

The strong interest and numerous engaging discussions at CSPT clearly demonstrated the growing importance of TGV processing and glass core substrates for the future of semiconductor packaging.

Thank you for visiting our booth, for the valuable exchange of ideas, and for your interest in our technologies. We look forward to continuing the conversation and shaping the future of semiconductor technology together.

» Explore the RENA Technologies wet processing equipment