Marangoni Dryer

What is a Marangoni Dryer and how does it work?

A Marangoni Dryer is a drying system used in semiconductor manufacturing to reliably dry wafers without residues after wet-chemical process steps such as cleaning, etching, or rinsing. The process is based on the so-called Marangoni effect: alcohol vapor - typically isopropyl alcohol (IPA) - modifies the surface tension of the liquid on the wafer surface. As a result, the water is displaced evenly and removed in a controlled manner.

In practice, the process takes place in several steps: first, the wafer is rinsed with ultrapure DI water. IPA vapor is then introduced to the water surface. Due to the change in surface tension, the liquid moves away from the wafer in a controlled way, allowing the wafer to dry uniformly and without watermarks.

This method prevents water stains, particle deposits, and chemical residues that could negatively affect sensitive semiconductor structures. It is particularly suitable for modern semiconductor devices with delicate surface structures.

Which method is more economical?

The operating costs and yield of microchip production are important factors to consider. Operating expenses include material expenses as part of the equation as well as utilization, throughput and yield.

Generally, throughput for wafer surface processing (wafer etching, wafer cleaning) is higher in batch systems than in single wafer systems. However, there are certain situations in which a single wafer system may be more suitable. For example, if the system works with smaller batches and can save time by using a single wafer system.

Which single wafer processing can be produced at RENA Technologies?

The wafers to be processed at RENA Technologies can be processed with the highest precision either in single wafer wet benches or in batch systems.

Our wafer handling systems enable wafer processing such as wafer etching, wafer cleaning, wafer drying in all common substrate formats: 100mm, 125mm, 150mm, 200mm and 300mm as well as all substrate materials and substrate thicknesses.

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