June 17, 2026
RENA Technologies Presents Innovative TGV Processing Solutions at the iTGV Forum 2026
We would like to thank the organizers and participants of the International Through Glass Via (TGV) Technology Innovation and Application Forum in Wuxi, China, for the opportunity to exchange ideas with leading experts from the semiconductor and advanced packaging industries.
As part of the conference program, RENA Technologies delivered a technical presentation entitled:
“Tuning of Through Glass Via (TGV) Shapes in Different Glass Types for Glass-Core Packaging Substrates”
A key focus of the presentation was RENA Technologies’ innovative alkaline etching technology, which provides an alternative to conventional hydrofluoric acid (HF)-based acidic etching processes.
During the presentation, we introduced a novel etching approach based on specialized alkaline processes and compared its performance with conventional acidic etching methods. The technology enables precise control and targeted optimization of TGV geometries across different glass types. This capability is particularly important for achieving closely spaced vias and forms the basis for the high integration densities required by future glass-core substrates and advanced packaging applications.
Key advantages include:
Precise tuning of TGV geometries for various glass types
Improved control of via profiles for high-density packaging applications
Support for closely spaced vias and advanced interconnect architectures
Greater process flexibility compared to conventional acidic etching methods
Enabling higher packaging densities through the precise shaping and positioning of Through Glass Vias (TGVs)
We would like to thank all participants for their strong interest, engaging technical discussions, and valuable exchange of ideas. We are proud to contribute to the advancement of glass-core substrate technologies and look forward to continuing the dialogue on the future of semiconductor packaging.
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