Wet Solutions for your Lab or Production

Designed for R&D - proven in mass production



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Immersion Wetbench

Revolution Acid or Solvent

  • Dimensions: 2,100 x 2,500 x 2,400 mm (WxDxH)
  • Maximum of 5 tanks
  • Variation of process tanks and rinses possible
  • Dryer option
Singe Wafer

Inception

  • Single wafer processing platform for semiconductor manufacturing
  • Dimensions: 900 x 1,900 x 2,200 mm (WxDxH)
  • Wafers up to 200 mm and masks up to 7 x 7
  • Etch uniformity exceeds batch systems
  • Manual or automated wafer handling
  • Single or dual load port
  • 2 to 4 chemical process tank
  • Hyper accurate concentration controls (ABB, Horiba, CI Semi)
  • Hyper accurate spiking capability (Chemical & DI)
  • Automatic chemical compensation for losses
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Drying

SRD Single or Dual

  • Spin Rinse Drying
  • Single or Dual Standard Chamber
  • Up to 8'' Wafers
  • SST version available
Chemical Delivery

CDU | Chemical Delivery Unit

  • CDU Solutions
    60L – Single & Twin
    200L – Single & Twin
    1000L – Single & Twin
  • RENA CDUs are available for acidic, alkaline and solvent
  • Master and Slaves Configurations
    Master Unit with 7 Slave Units
    Master can be at the left or at right side of the system
  • Materials and Pipes
    Basic Body: PP, C-PVC, SS
    Rollers: PE, electroconductive
    Drum connection:Quick connect, PE
    Piping Material: PP, PVDF, PFA and SS

Managed and Certified Quality

RENA facts
  • Founded: 1993
  • Areas of activity: mechanical and process engineering
  • Sectors: semiconductor, solar, additve manufacturing, glass and medtech industries
  • Global market leader in wet chemical inline and batch processes for manufacturing solar cells
  • More than 3,300+ systems installed worldwide
  • Around 1,200 employees worldwide
  • Headquarters: Gütenbach (Black Forest)

Suiting your semiconductor application

Whether you're producing MEMS, logic circuits, sensors, LEDs, RF components, ICs, power electronics, automotive parts, or optical components, we have you covered. Our tools are capable of handling pure silicon wafers as well as glass and compound wafers, including silicon carbide, gallium nitride, and gallium arsenide. We can process various wafer sizes ranging from 100 mm to 300 mm, depending on the substrate material.

Theo-Moissidis-Head-of-Sales
VP Sales
Theo Moissidis
ResponsibleResponsible for the following countries:
Worldwide