Polish Cleaning System - PCS

The PCS - wet to dry post-polish cleaning system removes particles, contamination and creates perfectly clean wafer surfaces. The tool handles wafers up to 300 mm diameter. Whether full or half-pitch setup, carrier or carrierless handling - the machine adapts to your requirements and integrates perfectly into your fab.

Features and benefits

  • Wet input cart integration
  • Outstanding surface cleanliness
  • Carrierless handling
  • Half-pitch process optional
  • Advanced Process monitoring
  • Multi-wafer transport to OHT loadport
Sales Director Semiconductor | Wafering
Bernard Winker
ResponsibleResponsible for the following countries: