Even if silicon solar wafers have been growing ever since, for quite a long period of time wafers have remained at a length of 156.75 mm, the so called generation M2. In the last 2 years the photovoltaics industry is undergoing a rapid change from the M2 standard to larger wafer sizes. As manufacturers are keen to bring down the cost per Watt on module level, new larger wafer sizes have been introduced. PV-manufacturers i.a. are promoting M6 wafers with a length of 166 mm and G13 with a length of even 230 mm and various sizes in between. This might be the start of a new age in the solar industry.
The requirements
In order to work with the new formats, production equipment has to be capable of handling bigger wafers as well as keeping process homogeneity and yield on highest levels. Another challenge manufacturers have to handle is the footprint of the tools. Larger wafers require either wider lanes, faster transport or bigger carriers. We at RENA managed to design our new Batch and NIAK Inline platforms to be capable
of handling up to G13 processing on identical footprint. Process stability is perfectly mastered by our expert developers and process engineers and achieved homogeneities are impressive. Even though large wafers are more vulnerable to mechanical damage our wet processing machines provide lowest breakage rates and highest yield as known from previous wafer generations.
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Cleaning and Texturing of Large Silicon-Wafers
As in previous machines RENA offers a mass production solution for cleaning and texturing processes in one single tool. The RENA BatchTex N600 is specifically designed to handle lager wafer sizes at the same stable performance. Damage etching, texturing and high-end cleaning are done in one single machine at a throughput of up to 15000 wafers per hour. The BatchTex N600 uses the IPA-free RENA monoTEX® process for texturing. Thus enabling best surface quality and low cost of ownership.
Single side wet processing up to G13 wafers
Further production steps like edge isolation, rear side polishing and phosphorous glass removal are the perfect szenario for our InEtchSide machine. It is based on our all new NIAK 4 platform. The choice is yours! The tool can handle wafer sizes from M0 to G13 for the processing of TOPCon, PERC, XBC or PERT silicon solar cells. However, the machine requires minimum footprint. Depending on the configuration it obtains a highest throughputs for G13, G12, and even higher yield with smaller sizes like M6 or M2.
It`s uncertain which or even if one of the new wafer sizes is going to be the next standard in pv-manufacturing. RENA wet processing tools however are capable of handling your desired wafer format – with RENA wet chemical equipment you are prepared for future developments. Have a chat with our experts about your future production plans. We are sure to meet your expectations.
