Successful Participation at ICEP-HBS 2026 in Hiroshima

From April 14 to 18, 2026, our Glass Team participated in the ICEP-HBS (International Conference on Electronics Packaging and Hybrid Bonding Symposium) in Hiroshima, Japan—a key international platforms for advanced packaging and semiconductor technologies.

Throughout the event, we had the opportunity to engage with industry experts, researchers, and partners from around the world. The conference provided an excellent setting for in-depth technical discussions and valuable knowledge exchange, particularly in the field of advanced materials and next-generation semiconductor applications.

A key focus of our presence was the exchange on wet processing solutions for Through-Glass Vias (TGVs). With increasing demand for high-performance and miniaturized components in photonics, RF applications, and advanced packaging, TGV technologies continue to gain importance. Our discussions highlighted how precise and reliable wet chemical processes are essential to ensure quality, yield, and performance in these applications.

We were especially pleased with the strong interest in our solutions and the many insightful conversations we had during the symposium. The direct feedback from industry professionals and the opportunity to explore new collaborations made this event a great success for our team.

We would like to thank all visitors, partners, and organizers for the inspiring exchange and look forward to continuing these conversations beyond the event.

» Explore the RENA Technologies wet benches in more detail

» If you would like to get in touch with our sales team, we look forward to hearing from you