RENA InEtchSide - automated processing equipment

Single Side Oxide Etching

The RENA InEtchSide automated processing equipment is designed for the single side removal of silicon oxide layers and doped glasses (e.g. PSG or BSG). This can be used in the fabrication of high efficiency cell concepts, e.g. for single side oxide etching using hydrofluoric acid (HF). It is based upon the RENA NIAK inline platform.

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Features and Benefits

Fully automated wet chemical single side etching in an inline type process on 5 lanes
Single side removal of silicon oxide (SiO2), doped glasses (PSG/BSG)
Uses HF for single side processing (additional chemistry optional, e.g. H2SO4 or BHF)
Integrated rinsing and drying of wafer
Throughput up to 5000 wafer/hour
Compatible with M0, M1, M2 and M4 wafer size
Long bath lifetime due to feed-and-bleed function
Accurate dosing system for constant bath composition
Uses O-ring free roller design
Lowest breakage rate in industry
Based on RENA NIAK inline processing platform
High uptime
Easy maintenance

Options

MES interface (SECS/GEM)
Media cabinet for chemical supply
Waste pump station for chemical drain / waste water
Sensors for process control (e.g. pH, conductivity)

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