Focused wet processing solutions for compound semiconductors

Silicon carbide (SiC) and other compound semiconductors are becoming increasingly important as demand for advanced power electronics rises. High bandwidth applications require special materials like SiC, GaAs, GaS, GaN and others.

The processing of composite semiconductors differs significantly from silicon manufacturing. Compound semiconductors require special cleaning and etching processes designed to achieve perfect results. At RENA we are dedicated to design innovative wet processing solutions for compound semiconductors. We manufacture surface treatment tools capable of processing wafer sizes up to 200 mm.

Contact us!

Get in touch!

RENA is focused on developing new processes of record for compound semiconductor including:

SiC wafer cleaning
SiC wet etching with ACE
Stable etch rate of InP, without the need for aging chemicals
Resist strip, nitride strip
High uniformity metal etch with TruEtch
High productivity metal lift off with FluidJet

Wet Process Technologies

Advanced Chemical Etching

RENA’s innovative process technology enabling porous and planar wet etching of SiC.

FluidJet - Metal Lift-off

RENA’s patented tank technology for metal lift-off and resist stripping with reliable performance and increased throughput.

TruEtch - Metal Etching

Patented immersion tank technology for metal etching resulting in superior etch uniformity.

TruEtch^® High uniformity wafer etching solution

RENA offers the TruEtch^® tank technology which provide a superior etch uniformity both across the wafer and from wafer to wafer. This outstanding metal etch uniformity, in an advanced immersion tank, has been achieved through a combination of wafer rotation and micro N2-bubble agitation. TruEtch^® can be integrated into our fully and semi automated wet benches.

General TruEtch^® Specification, 5mm Edge Exclusion: