SEMICON Korea 2026: Advancing Through Glass Via (TGV) Technology for Next-Generation Semiconductors

SEMICON Korea 2026 at COEX, Seoul – what an incredible three days!
A big thank you to everyone who visited our glass and semiconductor experts at the WOOWON Technology booth.

Together, we showcased the future of Through Glass Via (TGV) technology and discussed how advanced glass panel processing is shaping the next generation of semiconductor manufacturing.

Driving Innovation in TGV Panel Processing & Wet Etching Solutions

At the exhibition, we highlighted our:

• Fully automated wet processing systems

• High-precision alkaline etching solutions

• Advanced TGV panel processing technologies

These solutions form the technological foundation for:

• AI data centers

• High-performance computing (HPC)

• Advanced chip architectures

• Heterogeneous integration & advanced packaging

As demand for higher data transfer rates, improved thermal performance, and miniaturization grows, TGV technology is becoming a key enabler in next-generation semiconductor design.

30+ Years of Expertise in Semiconductor & Glass Processing

With over two decades of field-proven experience, we support processing solutions for:

• Silicon (Si)

• Glass substrates

• Silicon Carbide (SiC)

• Gallium Nitride (GaN)

• Indium Phosphide (InP)

• Other high-growth semiconductor materials

Our expertise includes precision etching, surface treatment, and scalable automation solutions tailored to the evolving needs of the semiconductor industry.

Missed Us at SEMICON Korea 2026?

If you couldn’t join us in Seoul, explore more about our:

• Through Glass Via (TGV) solutions

• Precision alkaline etching technology

• Automated wet processing systems

Contact our Glass and semiconductor specialists to learn how we can support your next project

» Discover our portfolio of wet-chemical equipment 

» If you would like to get in touch with our sales team, we look forward to hearing from you