June 18, 2026
TGV Panel Processing in Focus at ECTC 2026
RENA Technologies looks back on a successful participation at ECTC 2026 (Electronic Components and Technology Conference) in Orlando, Florida. Discussions throughout the event focused on Through-Glass Vias (TGVs) and the growing importance of glass-based packaging technologies for the next generation of semiconductor manufacturing.
TGVs as a Key Technology for Advanced Packaging and AI
As Artificial Intelligence (AI), High-Performance Computing (HPC), and AI data centers continue to grow rapidly, the demand for more powerful, energy-efficient, and compact chip architectures is increasing. Through-Glass Vias (TGVs) and glass interposers are emerging as key enabling technologies for advanced packaging.
TGVs enable innovative packaging concepts with improved electrical performance and high integration density. As a result, they play a vital role in the advancement of modern semiconductor solutions for AI and other data-intensive applications.
Wet Processing Solutions for Demanding TGV Applications
At ECTC 2026, RENA Technologies showcased its wet processing solutions as well as specialized TGV panel processing equipment designed to meet the demanding requirements of glass-based substrates.
Key benefits of RENA's TGV processing solutions include:
Extremely low taper angles down to 1 degree
Very short process times
High-aspect-ratio through-glass vias
Connecting with the ECTC Community
Discussions with customers, partners, and industry experts at ECTC 2026 demonstrated that TGV technology is playing an increasingly important role in the development of future semiconductor packages. Particularly in the context of AI-driven applications, glass-based interposer and packaging solutions continue to gain momentum.
We would like to thank all visitors to our booth for the valuable discussions, insightful exchanges, and strong interest in our TGV solutions.