Metal etching is a crucial step in semiconductor fabrication and packaging to pattern interconnects and conduction paths. For this purpose, RENA offers the TruEtch tank technology which provide a superior etch uniformity both across the wafer and from wafer to wafer. This outstanding metal etch uniformity, in an advanced immersion tank, has been achieved through a combination of wafer rotation and micro N₂-bubble agitation. TruEtch can be integrated into our fully and semi automated wet benches. RENA’s tank design has been patented and protected in USA, Europe and Asia.

This metal etch technology can be applied to manufacture MEMS devices, RF ICs and optocouplers with metal patterns in the size range of 2-5 µm. Various metals such as noble metals, copper (Cu) and titanium-tungsten (TiW) on various substrates such as Si, SiO₂ and III-V compounds can be etched using the TruEtch tank.

(Patent Protected in USA, Europe, and Asia Patent No. 9,562,291)

Piranha etch is used to clean photoresist and other hard-to-remove organic residues from silicon wafers. For wafer cleaning, Piranha etch, is a mixture of sulfuric acid (H₂SO₄) and hydrogen peroxide (H₂O₂) Removal of gross organic materials from Si wafers, such as hardened photoresist polymer patterns after ion implantation, and other visible contaminants of organic nature, can be accomplished by using mixtures of H₂SO₄(98 wt%) and H₂O₂ (30 wt%). Volume ratios of 2:1-4:1 are used at a temperature of 100-130C. Organics are destroyed and eliminated by wet-chemical oxidation, but inorganic contamination, such as metals, are not absorbed. Many different mixture ratios are commonly used for Si wafer cleaning. A typical mixture is 3:1 concentrated sulfuric acid to 30% hydrogen peroxide solution; other protocols may use a 4:1 or even 7:1 mixture. RENA’s Piranha solution offers exceptional process control with our proprietary IDX Flexware Process Control software, and complete wafer drying post clean, with our Genesis Marangoni drying system.

Using a proprietary patterned interface through a superior immersion wet processing system designed with integrated wafer rotation and precise micro bubble agitation results in a superior wetting process with increased uniformity of the layer patterns RENA’s custom Gold Etch solution is offered in its production-ready, high-performance Revolution Wet Processing system. A multi-step, semi-automatic wet bench with custom-tailored processes and features. To include modeled flow mapping, integrated N2 agitation, proprietary re-circulation, and RENA’s unique wafer rotation process that solves many uniformity issues found in other systems.